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LITHO MASKLESS is maskless lithography equipment, based on a dynamic mask technology using TI’s 0.65” DMD (Digital Mirror Device) and an upright microscope system, compatible with a wide range of resists and substrates. The system can expose any 2D or 2.5D shapes at micron resolution without an expensive hard mask.

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Quick and easy  to use

Adjustable
pattern size and resolution

Compatible
with various microscopes

High intensity
and high resolution

Easy alignment (EasyalignTM)

AI based uniformity
compensation (AIUniBeamTM)

Compatible Microscope List
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OLYMPUS
BX

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NIKON

ECLIPSE LV

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Thorlabs

Cerna

Specifications
Pattern Generator
0.65" DMD
Pattern Pixel
1920 x 1080
Radiometric Flux
4 W
Wavelength
365nm / 385nm / 405nm
Intensity
Max 4.0W/cm2 @20x
Uniformity
> 90 %
Pattern Format
PNG
OS
Windows
Lens Specificaitons
Objective Lens
5x
10x
20x
50x
100x
NA
0.15
0.3
0.45
0.8
0.9
Pattern Size(μm)
2903x1633
1452x816
726x408
290x163
145x82
CD(μm)
3.29
1.65
1.24
0.82
0.62

  • The specifications is from Olympus system (Olympus BX53)

  • CD(Critical Dimension) is estimated value at 405nm

  • LITHO MASKLESS is optimzed in 20x objective lens system

Applications
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